Description
• Low Profile Package
• Built-in Strain Relief
• Glass Passivated Junction
• Low Inductance
• 1.0W Peak Pulse Power
• Typical IR Less Than 5.0μA Above 11V
• High Temperature Soldering Guaranteed: 260℃/10 Seconds At Terminals
• Plastic Package Has Underwriters Laboratory Flammability 94V-0
• REACH/RoHS III Complaint and Halogen Free
• Cross Main Competitor Parts in Market
APPLICATION
• For SMD application